By Masayuki Yokoi (auth.), Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi (eds.)
This booklet discusses the clinical mechanism of copper electrodeposition and it truly is wide selection of functions. The booklet will conceal every thing from the fundamental basics to useful purposes. furthermore, the publication also will hide very important themes such as:
• ULSI wiring fabric established upon copper nanowiring
• revealed circuit forums
• Stacked semiconductors
• via Silicon through
• tender copper foil for Lithium-Ion battery electrodes
This e-book is perfect for nanotechnologists, execs, and practitioners.
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Additional resources for Copper Electrodeposition for Nanofabrication of Electronics Devices
Tindall GW, Bruckenstein S (1968) A ring-disk electrode study of the deposition and stripping of thin copper films at platinum in sulfuric acid. Anal Chem 40:1637–1640 16. 2 M sulfuric acid on platinum. Anal Chem 40:1051–1054 17. Tindall GW, Bruckenstein S (1968) Determination of heterogeneous equilibrium constants by chemical stripping at a ring disk electrode. Anal Chem 40:1402–1404 18. Yokoi M, Konishi S, Hayashi T (1983) Mechanism of the electrodeposition and dissolution of copper in an acid copper sulfate bath.
PEG ? 01 V versus SHE for 2000s. (by Jin et al. ) 2 Supression Effect and Additive Chemistry 41 the character of the adsorption films formed on copper surfaces by conducting systematic double-step electrolysis with two consecutive plating baths. They found that PEG can adsorb in the presence of Cl- in a Cu2+-free solution, but does not strongly inhibit deposition when subsequently immersed in a CuSO4 solution. Only when Cl- and PEGs are present in the solution where Cu2+ is being reduced is strong inhibition observed.
Hayase M, Taketani M, Aizawa K, Hatsuzawa T, Hayabusa K (2002) Copper bottom-up deposition by breakdown of PEG-Cl inhibition. Electrochem Solid-State Lett 5(10):C98–C101 31. Hayase M, Taketani M, Hatsuzawa T, Hayabusa K (2003) Trenches by consumption of halide ion preferential copper electrodeposition at submicrometer. Electrochem Solid-State Lett 6(6):C92–C95 32. Dow Wei-Ping, Liu De-Huei, Chun-Wei Lu, Chen Chien-Hung, Yan Jhih-Jyun, Huangb SuMei (2011) Through-hole filling by copper electroplating using a single organic additive.
Copper Electrodeposition for Nanofabrication of Electronics Devices by Masayuki Yokoi (auth.), Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi (eds.)