Get Advanced millimeter-wave technologies : antennas, packaging PDF

By Duixian Liu; et al

ISBN-10: 047099617X

ISBN-13: 9780470996171

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Extra resources for Advanced millimeter-wave technologies : antennas, packaging and circuits

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C. Bose (1858–1937) and his experimental setup with mmWave components such as horn antennas, polarizers, dielectric lenses and prisms to transmit and detect mmWave radiation at the Royal Institution, London, UK, January 1897 [5], reproduced by permission of © 1997 IEEE. 2: A 60 GHz radio receiver using individually packaged devices, each in a solid metal housing (split-block) with waveguide interconnects. Reproduced by permission of © IBM. to integrate mmWave components in the same way as we have shrunk the size of cell phones and computer chips?

This is done by shifting the die location on the die paddle close to the RF pin. This affects the length of other wire-bonds such as supply and control connections, since the die paddle size is fixed for a given number of input/output pins. Caution therefore needs to be taken to ensure sufficient bypassing of the out-of-package capacitors, which have to complement the on-chip bypass capacitors through the wire-bond inductance. 2 Chip-on-board at mmWaves Strictly speaking, COB or direct chip attach (DCA) devices are non-packaged devices.

Transmitter, detector, and horn antenna used by J. C. 1 [5]. Today one may wonder why mmWave and radio communication systems have not penetrated everyday applications in the same way? 1: J. C. Bose (1858–1937) and his experimental setup with mmWave components such as horn antennas, polarizers, dielectric lenses and prisms to transmit and detect mmWave radiation at the Royal Institution, London, UK, January 1897 [5], reproduced by permission of © 1997 IEEE. 2: A 60 GHz radio receiver using individually packaged devices, each in a solid metal housing (split-block) with waveguide interconnects.

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Advanced millimeter-wave technologies : antennas, packaging and circuits by Duixian Liu; et al


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